Seok-Hee Lee has been appointed Executive Vice President of Intel’s contract chip-manufacturing business, reinforcing the company’s efforts to expand its foundry capabilities and strengthen its position in the global semiconductor industry.

In his new role, Lee will lead advanced packaging, system integration, and back-end manufacturing operations within Intel Foundry, reporting directly to Lip-Bu Tan. A highly respected semiconductor industry leader, Lee previously served as CEO of SK On and SK hynix, bringing extensive experience in semiconductor manufacturing, technology leadership, and global operations.

The appointment comes as Intel intensifies its focus on rebuilding and scaling its foundry business amid growing demand for advanced chip manufacturing and AI-driven technologies. It also follows recent developments surrounding Apple’s plans to collaborate with Intel on chip design and manufacturing initiatives in the United States.

CXO TechBOT wishes Seok-Hee Lee great success in his new role.